Ansys IcepakAnsys
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About
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Perform conduction, convection, and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Ansys’ complete PCB design solution enables you to simulate PCBs, ICs, and packages and accurately evaluate an entire system.
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About
iGRAF is an integrated powder and multiphase flow simulation tool that seamlessly merges the domains of powder and fluid simulation. It is designed as a one-stop solution for replicating a wide variety of powder behaviors and redefining standards in simulation technology. iGRAF’s integrated DEM-CFD solver enables accurate and efficient analysis of single-phase and multiphase flow, helping users understand particle-fluid interactions in one platform. Its dynamic geometry control supports translations, rotations, vibrations, and user-defined motion, allowing teams to precisely capture the dynamics of complex systems. It includes validated liquid bridging models and van der Waals forces to analyze the influence of moisture and adhesion on particle behavior, with its liquid bridge force model extensively validated up to 15% moisture content. iGRAF also combines the Signed Distance Function and Immersed Boundary Method to recognize arbitrary solid geometries.
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Platforms Supported
Windows
Mac
Linux
Cloud
On-Premises
iPhone
iPad
Android
Chromebook
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Platforms Supported
Windows
Mac
Linux
Cloud
On-Premises
iPhone
iPad
Android
Chromebook
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Audience
Engineers looking for a cooling simulation software for their electronic components
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Audience
Powder-processing engineers, materials researchers, and equipment designers who need a tool to analyze particle-fluid behavior, mixing, segregation, moisture effects, and flow systems
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Support
Phone Support
24/7 Live Support
Online
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Support
Phone Support
24/7 Live Support
Online
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API
Offers API
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API
Offers API
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Screenshots and Videos |
Screenshots and Videos |
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Pricing
No information available.
Free Version
Free Trial
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Pricing
No information available.
Free Version
Free Trial
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Reviews/
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Reviews/
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Training
Documentation
Webinars
Live Online
In Person
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Training
Documentation
Webinars
Live Online
In Person
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Company InformationAnsys
United States
www.ansys.com/products/electronics/ansys-icepak
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Company InformationiGRAF
Founded: 2017
Japan
igraf-kke.com/en/software-en/
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