VSim
VSim is the Multiphysics Simulation Software used by design engineers and research scientists who require precise solutions for challenging problems. VSim’s unique combination of Finite-Difference Time-Domain (FDTD), Particle-in-Cell (PIC), and Charged Fluid (Finite Volume) methods deliver accurate results for a variety of situations, including plasma modeling. As a parallel software application, VSim can efficiently handle problems at scale, and simulations run quickly using algorithms designed for high-performance computing systems. Trusted by researchers in 30 countries, and used by engineers in industries from aerospace to semiconductor manufacturing, With documented accuracy, VSim provides results that users can trust. Created by a team of computational scientists, Tech-X’s code has been cited thousands of times in the scientific literature, and VSim can be found at many of the world’s top research institutions.
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FEATool Multiphysics
FEATool Multiphysics - "Physics Simulation Made Easy" - a fully integrated physics, FEA, and CFD simulation toolbox.
FEATool Multiphysics is a fully integrated simulation platform with a unified interface for several Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) multi-physics solvers, such as OpenFOAM, SU2 Code, and FEniCS. This uniquely allows for modeling coupled physics phenomena such as found in fluid flow, heat transfer, structural, electromagnetics, acoustics, and chemical engineering applications, within a single user-friendly interface. With these capabilities, FEATool Multiphysics has become trusted tool by engineers and researchers worldwide to accelerate innovation and quickly achieve results in the energy, automotive, semi-conductor, and process industries.
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TAITherm
Simulate the complete range of heat transfer phenomena, from convection to radiation, storage to dissipation, and steady-state to dynamic and transient environmental influences. TAITherm thermal analysis software is as easy to use as it is powerful. It solves for solar and thermal radiation, convection, and conduction, including ever-changing environments. TAITherm removes the burden of complicated thermal simulations and ensures that your design will function optimally in real-world scenarios. TAITherm is used by thousands of engineers and teams around the globe. Our customers use TAITherm for an array of applications including the latest advancements in automotive, electronics, wearables, military technology, architecture, and more. Our customers are pushing the boundaries of new technology by increasing usability, safety, and effectiveness in their industries through thermal simulations and thermal analysis.
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Ansys Icepak
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Perform conduction, convection, and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Ansys’ complete PCB design solution enables you to simulate PCBs, ICs, and packages and accurately evaluate an entire system.
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