This is a Tcl/Tk interface to a set of FORTRAN subroutines which implementempirical formulae for Physical Sputtering, Chemical Sputtering, RadiationEnhanced Sublimation. More PSIs to be added (Backscattering, etc..)
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1) Cleaned up all the subroutines (physic sputtering, chemical sputtering and RES). 2) Some basic software engineering introduced (like returning 0 when yields become negative). 3) Made the chemical sputtering smoothly transit from low flux to high flux (parameter C in J. Roth's paper). 26-02-2003 Manoj
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