Re: [Pcb-bugs] [Bug 718342] Re: solder paste rendered larger than mask

[Stephen E. <71...@bu...>]

On Fri, Feb 25, 2011 at 5:11 PM, Ineiev <71...@bu...> wrote:
> For improving my literacy: is the "L" suffix needed in this line?

Hi Ineiev,
For modern systems it is not required.  I am in the habit of adding
the "L" suffix as defensive programming - some very old compilers
treat constants as 16 bit unless you add the "L".  Probably these
compilers aren't used any more :)  From memory it was the Gaio
compiler for the H8 microcontroller, or similar.  I don't think that
PCB will be ported to H8 any time soon ;-), so feel free to remove the
"L".
Best regards,
Stephen

-- 
You received this bug notification because you are a member of PCB Bug
Team, which is subscribed to pcb.
https://bugs.launchpad.net/bugs/718342

Title:
  solder paste rendered larger than mask

Status in PCB: Printed Circuit Board CAD package:
  New

Bug description:
  The solder mask of a pad can be configured smaller than the pad
  itself. This is useful, if the pad is used as a heat sink. An example
  is my MMIC footprint according to the specs of Minicircuits:
  http://www.gedasymbols.org/user/kai_martin_knaak/footprints/specific/MINICIRCUITS_MMIC.fp

  However, the solder paste pattern emitted by pcb does not care for the
  solder mask. The solder paste always covers the entire pad. For masks
  smaller than than the pad dimensions this results in solder paste on
  top of solder mask. This is clearly not useful and results in
  complains by the fab.

  Suggestion: Adjust solder paste size to solder mask dimensions if
  these are smaller than the pad.

  ---<)kaimartin(>---