Ansys Sherlock
Ansys Sherlock is the only reliability physics-based electronics design tool that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early stage design. Ansys Sherlock automated design analysis provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages. Sherlock bypasses the ‘test-fail-fix-repeat’ cycle by empowering designers to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs) and assemblies to predict failure risks due to thermal, mechanical and manufacturing stressors--all before prototype. With embedded libraries containing over 500,000 parts, Sherlock rapidly converts electronic computer-aided design (ECAD) files into computational fluid dynamics (CFD) and finite element analysis (FEA) models. Each model contains accurate geometries, material properties and translates stress information.
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Simcenter Simsolid
Simcenter Simsolid is a Siemens simulation and structural analysis tool that helps designers and engineers analyze fully featured CAD assemblies without geometry simplification or meshing. By removing two of the most time-consuming steps in traditional FEA, it allows teams to validate structural performance much faster. The software can handle large and complex assemblies, including models with rough contact surfaces, gaps, or overlapping geometry. Simcenter Simsolid delivers accurate results in seconds to minutes on a standard PC, making it useful for rapid design comparison and simulation-driven development. It supports a wide range of analysis types, including linear and nonlinear statics, thermal analysis, modal analysis, fatigue analysis, dynamic simulations, buckling, composites, and random response. With CAD interoperability, advanced connections, materials, boundary conditions, and visualization tools, Simcenter Simsolid helps teams bring better products to market faster.
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Thermal Desktop
Thermal Desktop includes all aspects of model creation. Built-in finite difference, finite element, and lumped capacitance objects can be combined in any configuration. Thermal-specific objects such as contact conductance, insulation, heat loads, and heaters can be added to model anything from automotive components to manned spacecraft. Thermal Desktop provides full parameterization using variables and arbitrarily complex expressions as input rather than hardwired numbers. These variables, called symbols, allow models to be rapidly manipulated with a few keystrokes, meaning updating or maintaining the model is easy, as is performing sensitivity studies and investigating what-if scenarios. This also provides access to SINDA/FLUINT’s optimization and reliability modules and automatic model correlation.
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RadCAD
An ultra-fast, oct-tree accelerated Monte-Carlo ray tracing algorithm is used by RadCAD to compute radiation exchange factors and view factors. Innovations by C&R Technologies to the ray tracing process have resulted in an extremely efficient thermal radiation software tool. Using finite difference "conics" (simple geometric objects) or curved finite elements from TD Direct®, RadCAD can accurately model diffuse or specular reflections and transmissive surfaces regardless of node density. The needs of the thermal solution dictate the number of nodes, not the accuracy requirements of the radiation. RadCAD makes use of user-defined databases of optical properties. Each surface coating defines absorptivity, transmissivity, and reflectivity along with specularity in both the solar and infrared wavelength regimes. These properties can be defined versus incident angle or even with wavelength dependence.
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