PowerFLOW
By leveraging our unique, inherently transient Lattice Boltzmann-based physics PowerFLOW CFD solution performs simulations that accurately predict real world conditions. Using the PowerFLOW suite, engineers evaluate product performance early in the design process prior to any prototype being built — when the impact of change is most significant for design and budgets. PowerFLOW imports fully complex model geometry and accurately and efficiently performs aerodynamic, aeroacoustic and thermal management simulations. Automated domain discretization and turbulence modeling with wall treatment eliminates the need for manual volume meshing and boundary layer meshing. Confidently run PowerFLOW simulations using large number of compute cores on common High Performance Computing (HPC) platforms.
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GASP
GASP is a structured/unstructured, multi-block CFD flow solver which solves the Reynolds Averaged Navier-Stokes (RANS) equations as well as the heat conduction equation for solid bodies. Hierarchical-tree based organization. Pre- and post-processing in one interface. Solves steady and unsteady 3-D, Reynolds-Averaged, Navier-Stokes Equations (RANS) and subsets. Multi-block structured/unstructured grid topology. Unstructured mesh support for tetrahdra, hexahedra, prisms, and pyramids. Integration with portable extensible toolkit for scientific computation library. Uncoupling of systems including turbulence and chemistry for improved computational efficiency. Support for most parallel computers, including clusters. Integrated domain decomposition is transparent to the user.
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Ansys Icepak
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Perform conduction, convection, and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Ansys’ complete PCB design solution enables you to simulate PCBs, ICs, and packages and accurately evaluate an entire system.
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Dive
Dive CAE is a cloud-native computational fluid dynamics software platform that enables engineers to simulate complex fluid behaviors, such as free-surface flow, multiphase interactions, heat transfer, and moving machinery, using a mesh-free Smoothed Particle Hydrodynamics method. It runs entirely in the browser and on high-performance computing infrastructure, so users don’t need local hardware or installation. The mesh-free approach allows for modeling of complex geometry, surface tension, non-Newtonian fluids, and transient flows without the time-consuming meshing and tuning required by conventional CFD. Onboarding is fast (typically under one day), and the software supports parallel design-of-experiment workflows that deliver multiple iterations in hours rather than days. Dive CAE emphasizes collaboration, license simplicity (one licence for all users), transparent cost control, data usage governance, and scalability via cloud infrastructure.
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