6SigmaET
6SigmaET is an electronics thermal modeling tool that uses advanced computational fluid dynamics (CFD) to create accurate models of electronic equipment. Designed specifically for the electronics industry, our thermal simulation software ushers in unparalleled intelligence, automation and accuracy to help you meet your requirements and overcome thermal design challenges. Since its inception in 2009, 6SigmaET has become the fastest-growing thermal simulation software in the electronics cooling market. The versatility of 6SigmaET allows you to simulate the thermal performance of electronic components: ranging from the smallest ICs to the largest, most powerful servers. Learn more about 6SigmaET's value to your industry by watching one of our videos or exploring our case studies. The complete CAD geometry of a device and PCB design can be imported into 6SigmaET for thermal analysis, reducing model creation time.
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Orbital Stack
Orbital Stack is an AI and CFD web-based software that provides earlier qualitative guidance, comparing a large number of design options while highlighting any potential wind and thermal comfort red flags. It allows for the realization of a variety of climate-conscious, high-performance developments not previously feasible due to cost and/or time constraints associated with traditional studies.
Orbital Stack is the first digital climate-analysis tool built by global leaders in wind and microclimate engineering using real wind tunnel data. It is truly a game-changer for the architecture and building design sector, offering our clients direct access to wind comfort and safety analysis, thermal comfort and shadowing analysis, and cladding pressure simulations. This means architects can run their own wind simulations and quickly understand the climate impacts of their proposed building designs from the start, making decisions that result in higher performing and more resilient projects.
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Ansys Icepak
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Perform conduction, convection, and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Ansys’ complete PCB design solution enables you to simulate PCBs, ICs, and packages and accurately evaluate an entire system.
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Simcenter Simsolid
Simcenter Simsolid is a Siemens simulation and structural analysis tool that helps designers and engineers analyze fully featured CAD assemblies without geometry simplification or meshing. By removing two of the most time-consuming steps in traditional FEA, it allows teams to validate structural performance much faster. The software can handle large and complex assemblies, including models with rough contact surfaces, gaps, or overlapping geometry. Simcenter Simsolid delivers accurate results in seconds to minutes on a standard PC, making it useful for rapid design comparison and simulation-driven development. It supports a wide range of analysis types, including linear and nonlinear statics, thermal analysis, modal analysis, fatigue analysis, dynamic simulations, buckling, composites, and random response. With CAD interoperability, advanced connections, materials, boundary conditions, and visualization tools, Simcenter Simsolid helps teams bring better products to market faster.
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