RecurDyn
RecurDyn is an interdisciplinary computer-aided engineering software package whose primary function is the simulation of Multi-Body Dynamics. It simulates both rigid and flexible body dynamics by combining traditional rigid multibody dynamics with cutting-edge finite element technology for modeling flexible bodies, known as Multi Flexible Body Dynamics. RecurDyn is designed to analyze the dynamic behavior of mechanical systems in motion, including systems with joints, constraints, contact, flexible components, forces, and complex interactions between parts. Its solver technology handles the differential algebraic equations that describe multibody systems, combining equations of motion with algebraic equations for joint constraints. It provides a robust MBD-specialized modeling environment, fast solvers, extensive post-processing, animation, plotting, and tools for evaluating the motion, loads, stresses, deformation, and performance of mechanical assemblies.
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PowerFLOW
By leveraging our unique, inherently transient Lattice Boltzmann-based physics PowerFLOW CFD solution performs simulations that accurately predict real world conditions. Using the PowerFLOW suite, engineers evaluate product performance early in the design process prior to any prototype being built — when the impact of change is most significant for design and budgets. PowerFLOW imports fully complex model geometry and accurately and efficiently performs aerodynamic, aeroacoustic and thermal management simulations. Automated domain discretization and turbulence modeling with wall treatment eliminates the need for manual volume meshing and boundary layer meshing. Confidently run PowerFLOW simulations using large number of compute cores on common High Performance Computing (HPC) platforms.
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GASP
GASP is a structured/unstructured, multi-block CFD flow solver which solves the Reynolds Averaged Navier-Stokes (RANS) equations as well as the heat conduction equation for solid bodies. Hierarchical-tree based organization. Pre- and post-processing in one interface. Solves steady and unsteady 3-D, Reynolds-Averaged, Navier-Stokes Equations (RANS) and subsets. Multi-block structured/unstructured grid topology. Unstructured mesh support for tetrahdra, hexahedra, prisms, and pyramids. Integration with portable extensible toolkit for scientific computation library. Uncoupling of systems including turbulence and chemistry for improved computational efficiency. Support for most parallel computers, including clusters. Integrated domain decomposition is transparent to the user.
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Ansys Icepak
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Perform conduction, convection, and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Ansys’ complete PCB design solution enables you to simulate PCBs, ICs, and packages and accurately evaluate an entire system.
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