GASP
GASP is a structured/unstructured, multi-block CFD flow solver which solves the Reynolds Averaged Navier-Stokes (RANS) equations as well as the heat conduction equation for solid bodies. Hierarchical-tree based organization. Pre- and post-processing in one interface. Solves steady and unsteady 3-D, Reynolds-Averaged, Navier-Stokes Equations (RANS) and subsets. Multi-block structured/unstructured grid topology. Unstructured mesh support for tetrahdra, hexahedra, prisms, and pyramids. Integration with portable extensible toolkit for scientific computation library. Uncoupling of systems including turbulence and chemistry for improved computational efficiency. Support for most parallel computers, including clusters. Integrated domain decomposition is transparent to the user.
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AutoCAD Plant 3D
The 2022 Plant 3D toolset is included with AutoCAD. Create and edit P&ID’s, 3D models, and extract piping orthographics and isometrics with industry-specific toolset for plant design. Collaborate on plant design models across project teams and maintain compliance requirements, all in a cloud-based common data environment. The Plant 3D toolset is delivered with standard symbol libraries in the tool palettes. They include PIP, ISA, ISO/DIN, and JIS. Quickly identify possible errors by scanning P&IDs for data consistency according to user-definable rules. Quickly create 3D plant models using parametric equipment modeling, structural steel libraries, and project-specific piping specifications using industry standard piping catalogs. Extract piping orthographic drawings directly from the 3D model and update them as the 3D model is being updated. Work with other industry disciplines to create BIM models for the plant.
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Dive
Dive CAE is a cloud-native computational fluid dynamics software platform that enables engineers to simulate complex fluid behaviors, such as free-surface flow, multiphase interactions, heat transfer, and moving machinery, using a mesh-free Smoothed Particle Hydrodynamics method. It runs entirely in the browser and on high-performance computing infrastructure, so users don’t need local hardware or installation. The mesh-free approach allows for modeling of complex geometry, surface tension, non-Newtonian fluids, and transient flows without the time-consuming meshing and tuning required by conventional CFD. Onboarding is fast (typically under one day), and the software supports parallel design-of-experiment workflows that deliver multiple iterations in hours rather than days. Dive CAE emphasizes collaboration, license simplicity (one licence for all users), transparent cost control, data usage governance, and scalability via cloud infrastructure.
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Ansys Icepak
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Perform conduction, convection, and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Ansys’ complete PCB design solution enables you to simulate PCBs, ICs, and packages and accurately evaluate an entire system.
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