Audience
Companies and engineers seeking a tool to prototype and analyze their system planning operations
About 3DIC Compiler
Synopsys 3DIC Compiler, built on the industry’s leading digital implementation platform and using a common fusion data model, enables seamless migration to 2.5/3D heterogeneous integration. In a single environment, the platform allows analysis-driven feasibility exploration, multi-die partitioning, and foundry technology selection for prototyping and floor planning. This enables analysis-driven design implementation, including advanced packaging and die-to-die routing, with golden signoff verification. 3DIC Compiler integrates with Synopsys 3DSO.ai, the industry’s first autonomous AI optimization solution for multi-die designs, to maximize system performance and quality of results for thermal integrity, signal integrity, and power network design. The 3DIC Compiler platform, successfully adopted by customers, is certified by leading foundries for advanced process and packaging technologies.
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Company Information
Synopsys
Founded: 1986
United States
www.synopsys.com/implementation-and-signoff/3dic-design.html
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