Best IC Design Software in Asia

Altium’s PDN Analyzer tool integrates directly with Altium Designer so you can easily troubleshoot and detect issues like insufficient or excessive copper, uncontrolled voltage drops, marginal voltage at critical power pins, copper islands or peninsulas and similar issues that may be present with the power system in your PCB design. PDN refers to the power system on printed circuit boards for active circuits. This system includes all interconnections from the voltage regulator module and the metallization of pads and die on integrated circuits that are used to supply and return power current. IC supply voltage limits must be met across the entire length of the power delivery network. Accurately validating your power budget means considering minimum and maximum device limits, worst-case voltage drops, and combined return-path currents. PDN Analyzer shows you exactly where these problems arise.

Ansys Exalto is a post-LVS RLCk extraction software solution that enables IC designers to accurately capture unknown crosstalk among different blocks in the design hierarchy by extracting lumped-element parasitics and generating an accurate model for electrical, magnetic and substrate coupling. Exalto interfaces with most LVS tools and can complement the RC extraction tool of your choice. Ansys Exalto post-LVS RLCk extraction lets IC designers accurately predict electromagnetic and substrate coupling effects for signoff on circuits that were previously "too big to analyze.” The extracted models are back-annotated to the schematic or netlist, and support all circuit simulators. The proliferation of RF and high-speed circuits in modern silicon systems has raised electromagnetic coupling to a first order effect that must be accurately modeled to reliably achieve silicon success.

Go beyond traditional RF simulation to design, analyze, and verify radio frequency integrated circuits (RFICs). Achieve confidence with steady-state and nonlinear solvers for design and verification. Wireless standard libraries accelerate the validation of complex RFICs. Before taping out an RFIC, verification of IC specifications via RF simulation is a must. Simulations include effects of layout parasitics, complex modulated signals, and digital control circuitry. With PathWave RFIC Design, you can simulate in both the frequency and time domain and bring your designs to and from Cadence Virtuoso. Accurately model components on silicon chips. Optimize designs with sweeps and load-pull analysis. Integrate RF designs in the Cadence Virtuoso environment. Increase performance using Monte Carlo and yield analysis. Simplify debugging with safe operating area warnings. Utilize the latest foundry technology immediately.

Ansys Maxwell is an EM field solver for electric machines, transformers, wireless charging, permanent magnet latches, actuators and other electr mechanical devices. It solves static, frequency-domain and time-varying magnetic and electric fields. Maxwell also offers specialized design interfaces for electric machines and power converters. With Maxwell, you can precisely characterize the nonlinear, transient motion of electromechanical components and their effects on the drive circuit and control system design. By leveraging Maxwell’s advanced electromagnetic field solvers and seamlessly linking them to the integrated circuit and systems simulation technology, you can understand the performance of electromechanical systems long before building a prototype in hardware. Maxwell offers a trusted simulation of low-frequency electromagnetic fields in industrial components.

Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Perform conduction, convection, and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Ansys’ complete PCB design solution enables you to simulate PCBs, ICs, and packages and accurately evaluate an entire system.

The use of Ansys Electronics solution suite minimizes testing costs, ensures regulatory compliance, improves reliability, and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products. Leverage the simulation capability from Ansys to solve the most critical aspects of your designs. With our solutions, we help you solve the most critical aspects of your product designs through simulation. If you work with antenna, RF, microwave, PCB, package, IC design, or even an electromechanical device, we provide you with the industry gold standard simulators. These solutions help you solve any electromagnetic, temperature, SI, PI, parasitic, cabling, and vibration challenges in your designs. We build on this with complete product simulation, allowing you to achieve first-pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system.

Sigrity X Advanced SI technology offers leading-edge signal integrity analysis for PCB and IC packaging designs, covering DC to over 56GHz with advanced features like automated die-to-die SI analysis, topology exploration, and simulation for high-speed interfaces. Supporting IBIS-AMI models and customizable compliance kits, it ensures your designs meet rigorous standards while leveraging frequency domain, time domain, and statistical analysis methods.

To ensure you get high performance at a system and component level, while at the same time saving between 15% and 50% in decoupling capacitor (decap) costs, Cadence® Sigrity X OptimizePI™ technology does a complete AC frequency analysis of boards and IC packages. Supporting both pre- and post-layout studies, it quickly pinpoints the best decap selections and placement locations to meet your power-delivery network (PDN) needs at the lowest possible cost. Sigrity X OptimizePI technology is built on proven Cadence hybrid electromagnetic circuit analysis technology in combination with the unique Sigrity optimization engine to help you quickly pinpoint the best possible decap selections and placement locations.

To help you tackle increasingly challenging issues related to simultaneous switching noise, signal coupling, and target voltage levels, Cadence® Sigrity X PowerSI® technology provides fast, accurate, and detailed electrical analysis of full IC packages or PCBs. It is cloud ready and can be used pre-layout to develop power- and signal-integrity guidelines, as well as post-layout to verify performance and improve a design without needing a prototype. Using Sigrity X PowerSI electromagnetic (EM) field solver technology, you can readily perform a broad range of studies to identify trace and via coupling issues, power/ground fluctuations caused by simultaneously switching outputs, and design regions that are under or over voltage targets. PowerSI technology also lets you perform extraction of frequency-dependent network parameter models and lets you visualize complex spatial relationships.

Our next-generation web platform empowers chip developers and verification engineers to design and debug 10x faster. Build and run thousands of tests in parallel at the push of a button with Verilator. Seamlessly share test results and waveforms with anyone in your organization, tag coworkers directly on signals, track test and regression failures. We use Verilator to compile Dockerized simulation binaries and distribute test runs across our compute cluster. Then we collect the results and log files and optionally rerun failing tests to generate waveforms. With Docker, we can ensure that test runs are consistent and reproducible. SiLogy makes chip developers more productive by enabling faster design and debug times. Before SiLogy, the state-of-the-art for debugging a failing test involved copying lines from log files, debugging from waveforms on a local machine, or rerunning a simulation that might have taken days to run.

Go beyond traditional RF simulation to design, analyze, and verify radio frequency integrated circuits (RFICs). Achieve confidence with steady-state and nonlinear solvers for design and verification. Wireless standard libraries accelerate the validation of complex RFICs. Model components on silicon chips accurately. Optimize designs with sweeps and load-pull analysis. Simulate RF designs in the Cadence Virtuoso and Synopsys Custom Compiler environments. Increase performance using Monte Carlo and yield analysis. Assess error vector magnitude (EVM) for the latest communication standards early in the design phase. Use the latest foundry technology immediately. Monitoring system IC specifications such as EVM via RF simulation early in the RFIC design phase is a must. Simulations include effects of layout parasitics, complex modulated signals, and digital control circuitry. With Keysight RFPro Circuit, you can simulate in both the frequency and time domain.

Deliver a faster time to market by reducing design complexity using high-quality DFT. Tessent silicon lifecycle management solutions include advanced debug, safety & security features, and in-life data analytics to meet the evolving challenges of today’s silicon lifecycle. Create an infrastructure that makes designs more testable. Silicon lifecycle management solutions achieve high-quality tests, identify defects and hidden yield limiters, and move beyond test into system debugging and validation. This ecosystem of tools effectively analyzes data to provide critical system insights that can then be used for in-life monitoring. Ensure the highest test quality, accelerate yield ramp, and improve safety, security, and reliability across the silicon lifecycle using best-in-class solutions for DFT, debug, and in-life monitoring plus powerful data analytics. Decrease time to yield, manage manufacturing excursions, and recover yield caused by systematic defects.

Step into the future with Sigrity X Platform – where innovation meets optimization. Unlock the key to flawless signal and power integrity in your PCB and IC package designs, and leap far beyond the current limits of signal integrity (SI)/power integrity (PI) technology. Imagine effortlessly navigating the complexities of electronic design, and not just meeting, but shattering your time-to-market targets with precision and ease. With Sigrity X, you're not just working with another tool; you're unlocking seamless in-design analysis synergy within the Allegro X PCB and IC Package platforms. Dive into a comprehensive suite of SI/PI analysis, in-design interconnect modeling, and PDN analysis tools designed to supercharge your performance, ensuring your projects not only meet but exceed deadlines and budgets. Harness the power of the Sigrity X Platform for flawless performance and reliability success in your next design.

The Solido variation-aware design, IP validation, library characterization, and simulation solutions, powered by proprietary AI-enabled technologies, are used by 1000s of designers at the top semiconductor companies worldwide. Integrated suite of AI-accelerated SPICE, Fast SPICE, and mixed-signal simulators designed to help customers dramatically accelerate critical design and verification for next-generation analog, mixed-signal, and custom IC designs. Providing the industry's fastest, most comprehensive integrated IP validation solution, providing complete, seamless IP QA from design to tape-out, across all design views and IP revisions. Comprehensive AI-powered design environment for nominal and variation-aware verification of custom IC circuitry enabling full design coverage in orders-of-magnitude fewer simulations, with the accuracy of brute-force techniques. Providing fast, accurate library characterization tools powered by machine learning.

Precision offers vendor-independent FPGA synthesis. It provides best-in-class performance and area, high-reliability design capabilities, and tight links to simulation and formal equivalency checking. Precision's products are tightly integrated with Siemens' FormalPro LEC for equivalency checking and HDL Designer for design capture and design verification using ModelSim/Questa. Precision RTL, Siemens's entry-level FPGA synthesis product, offers best-in-class quality results with a vendor-independent FPGA synthesis solution. Many space and mil-aero applications require specialized FPGAs with built-in protection from SEEs. NanoXplore introduces new FPGAs targeting this market. Precision Synthesis, in close partnership with NanoXplore, is the first to offer full synthesis support for the NG-Ultra device. Precision has seamless integration with the NXmap P&R tool to complete the design flow from RTL to gates to bitstream generation.

PowerPro offers the most comprehensive set of features to RTL designers to “design-for-low-power”. It offers power estimation for both RTL and Gate-level designs, early power checks to quickly find power issues during RTL development, and clock and memory gating to optimize the design for power. PowerPro offers the most comprehensive set of features to RTL designers to “design-for-low-power”. It offers power analysis for both RTL and gate-level designs, early power checks to quickly find power issues during RTL development, and clock and memory gating to optimize the design for power. PowerPro delivers highly accurate estimations that are within 10% of signoff. This technology is built on advanced engines that enable a broad spectrum of analysis capabilities. PowerPro’s automatic power optimization delivers low-power RTL automatically with integrated logic equivalence checking. PowerPro’s automatic optimization is the only proven low-power RTL generation technology in the market today.

Oasys-RTL addresses the need for higher capacity, faster runtimes, improved QoR, and physical awareness by optimizing at a higher level of abstraction and using integrated floorplanning and placement capabilities. Oasys-RTL provides better quality results by enabling physical accuracy, floorplanning, and fast optimization iterations to get to design closure on time. The power-aware synthesis capabilities include support for multi-threshold libraries, automatic clock gating, and UPF-based multi-VDD flow. During synthesis, Oasys-RTL inserts all the appropriate level shifters, isolation cells, and retention registers depending on the power intent as defined in the UPF. Oasys-RTL can create a floorplan directly from the design RTL using design dataflow and timing, power, area, and congestion constraints. It considers regions, fences, blockages, and other physical guidance using the advanced floorplan editing tools and automatically places macros, pins, and pads.

Design your photonic integrated circuit in a layout-centric flow. The designer can implement their design using either a drag-and-drop or a script-driven methodology. Both of those are in the same full custom IC design layout editor that drives the physical verification and tape-out processes. L-Edit Photonics enables the fast creation of a photonic design using a drag-and-drop methodology in an IC layout editor, without having to write a single line of code. Once the design is completed, a netlist can be extracted for photonic simulation. PIC design in a complete IC layout editor, Create a layout without writing a line of code. Supports a layout-centric design flow where a schematic is not needed. Schematic flow optional with S-Edit. A simulation netlist can be created as input into a photonic simulator. Photonic simulation is supported through integration with our partners. Photonic PDKs are available from multiple foundries.

L-Edit MEMS is the gold standard 3D MEMS design platform of choice. The digital twin of the MEMS devices begins with the design capture in L-Edit. MEMS designers benefit from a unified environment that supports MEMS device design, fabrication modeling, and links to FEM analysis tools. L-Edit MEMS is the gold standard for MEMS design. With true native curve support, it is the only tool developed specifically for MEMS and IC design. It is the foundation of the MEMS digital twin, supporting device design, 3D fabrication modeling, and simulation through partnerships. Create a 3D solid model from layout data and fabrication process description. Gives a 3D graphical representation of the MEMS fabrication process. Multi-physics simulation with popular FEM analysis tools. Export models to FEM/BEM simulators for 3D analysis. Component libraries enable design reuse.

Designing at advanced process nodes requires a new place-and-route paradigm to manage the increasing complexity. Aprisa is a detail-route-centric physical design platform for the modern SoC. Aprisa digital implementation is an RTL2GDSII solution that offers complete synthesis and place-and-route functionality for top-level hierarchical designs and block-level implementation. It's tape-out quality correlation with signoff tools, both for STA timing and DRC, reduces design closure and ensures optimal performance, power, and area (PPA). Aprisa delivers optimal PPA out-of-the-box. This helps physical designers reduce the effort at each step of the place-and-route flow and achieve faster time-to-market Unified architecture and common analysis engines ensure excellent timing and DRC correlation between implementation steps and with signoff tools, greatly reducing the number of flow iterations and ECOs.

Foundry-certified, the AFS Platform delivers nm SPICE accuracy, 5x faster than traditional SPICE and >2x faster than parallel SPICE simulators. Offering the fastest nm circuit verification platform for analog, RF, mixed-signal, and custom digital circuits. Now includes new eXTreme technology. For large post-layout circuits, the new AFS eXTreme technology delivers over 100M-element capacity and is 3x faster than post-layout simulators. Supports all leading digital solvers. Best-in-class usability, allowing maximum reuse of verification infrastructure. Advanced verification and debug capabilities to improve verification coverage. Improved design quality, and time-to-market. SPICE accurate, high-sigma verification. 1000x faster than brute-force simulation. Easy to use, and deploy. AFS eXTreme technology is available at no additional cost.