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About

Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Perform conduction, convection, and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Ansys’ complete PCB design solution enables you to simulate PCBs, ICs, and packages and accurately evaluate an entire system.

About

With CONSELF you can exploit Computational Fluid Dynamics (CFD) and Finite Element Analysis (FEA) to improve your products design: minimize drag and fluid dynamics losses, increase efficiency, maximize heat exchange performances, estimate pressure loads, verify material resistance, evaluate components shape deformation, calculate natural frequencies and modes, and much more. Static and dynamic simulations are available for Structural Mechanics, with both elastic and plastic materials behavior. Modal and frequency analyses can also be carried out starting from most common CAD neutral file formats.

Platforms Supported

Windows
Mac
Linux
Cloud
On-Premises
iPhone
iPad
Android
Chromebook

Platforms Supported

Windows
Mac
Linux
Cloud
On-Premises
iPhone
iPad
Android
Chromebook

Audience

Engineers looking for a cooling simulation software for their electronic components

Audience

Cloud-based simulation solution for individuals

Support

Phone Support
24/7 Live Support
Online

Support

Phone Support
24/7 Live Support
Online

API

Offers API

API

Offers API

Screenshots and Videos

Screenshots and Videos

Pricing

No information available.
Free Version
Free Trial

Pricing

No information available.
Free Version
Free Trial

Reviews/Ratings

Overall 0.0 / 5
ease 0.0 / 5
features 0.0 / 5
design 0.0 / 5
support 0.0 / 5

This software hasn't been reviewed yet. Be the first to provide a review:

Review this Software

Reviews/Ratings

Overall 0.0 / 5
ease 0.0 / 5
features 0.0 / 5
design 0.0 / 5
support 0.0 / 5

This software hasn't been reviewed yet. Be the first to provide a review:

Review this Software

Training

Documentation
Webinars
Live Online
In Person

Training

Documentation
Webinars
Live Online
In Person

Company Information

Ansys
United States
www.ansys.com/products/electronics/ansys-icepak

Company Information

CONSELF
Founded: 2017
Italy
conself.com

Alternatives

Alternatives

Energy2D

Energy2D

The Concord Consortium
COMSOL Multiphysics

COMSOL Multiphysics

Comsol Group
TAITherm

TAITherm

ThermoAnalytics

Categories

Categories

Simulation Features

1D Simulation
3D Modeling
3D Simulation
Agent-Based Modeling
Continuous Modeling
Design Analysis
Direct Manipulation
Discrete Event Modeling
Dynamic Modeling
Graphical Modeling
Industry Specific Database
Monte Carlo Simulation
Motion Modeling
Presentation Tools
Stochastic Modeling
Turbulence Modeling

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent
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