"E-plater" is a device that was specially developed by Engenharia Caseira (engenhariacaseira.com.br) to make pulsed and reversed pulsed electroplating (PED).

Research shows that molecules on the surface of electrically deposited material using direct current are sometimes disorganized which can result in uneven surface and color.

It is possible to control the composition and thickness of the deposited layer in an atomic order by configuring the amplitude and width of a pulse. The pulses favor the initiation of grain nuclei and increase the number of grains per unit of surface resulting in the thinner deposit with better properties.

Features

  • Power supply: 12V DC
  • Maximum output current: 7A
  • Pulse loop sequence: A+ K-, idle, K+ A-, idle
  • Minimum period of each pulse stage: 10uS
  • Maximum period of each pulse stage: 127.5mS
  • Minimum operatind time of the pulse generator: 1 minute
  • Maximum operating time of the pulse generator: 120 minutes
  • Interface: LCD, Two buttons

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Categories

Chemistry

License

Public Domain

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Additional Project Details

Languages

English

Programming Language

C

Related Categories

C Chemistry Software

Registered

2016-10-17