Simcenter Flotherm
With more than 34 years of development and user feedback, Simcenter Flotherm is the leading electronic cooling simulation software solution for electronic thermal analysis. It shortens development at IC package, PCB, and enclosure level through to large systems such as data centers. Improve electronics thermal management for reliability with fast, accurate electronics cooling CFD simulation from initial pre-CAD exploration to final verification. Simcenter Flotherm integrates with the electronics development workflow as a tool for thermal engineers to perform simulations and provide timely accurate results and feedback to other engineering functions. It supports thermal management, and simulation-based decision-making from early-stage architecture to final thermal design verification. This aids shortened development and also helps to eliminate risks of costly reliability-related warranty costs or any late-stage re-spins.
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TAITherm
Simulate the complete range of heat transfer phenomena, from convection to radiation, storage to dissipation, and steady-state to dynamic and transient environmental influences. TAITherm thermal analysis software is as easy to use as it is powerful. It solves for solar and thermal radiation, convection, and conduction, including ever-changing environments. TAITherm removes the burden of complicated thermal simulations and ensures that your design will function optimally in real-world scenarios. TAITherm is used by thousands of engineers and teams around the globe. Our customers use TAITherm for an array of applications including the latest advancements in automotive, electronics, wearables, military technology, architecture, and more. Our customers are pushing the boundaries of new technology by increasing usability, safety, and effectiveness in their industries through thermal simulations and thermal analysis.
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Altair SimSolid
By performing structural analyses on fully featured CAD assemblies within minutes, SimSolid is the game-changing simulation technology for designers, engineers, and analysts. It eliminates geometry preparation and meshing: the two most time-consuming, expertise-extensive and error-prone tasks performed in a conventional structural simulation.
Multiple design scenarios can be simulated quickly under real-life conditions. Early CAD models, in any common format, can be used. SimSolid tolerance of imprecise geometry means that, unlike CAD-embedded simulation tools, there is no need to simplify complex geometries before analyzing designs.
SimSolid supports all typical connections (bolt/nut, bonded, welds, rivets, sliding) and analysis of linear static, modal, thermal properties, along with more complex coupled, nonlinear, transient dynamic effects.
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Ansys Icepak
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Perform conduction, convection, and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Ansys’ complete PCB design solution enables you to simulate PCBs, ICs, and packages and accurately evaluate an entire system.
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