Audience
PCB design tool for companies wanting to ensure reliable power delivery
About Celsius PowerDC
To ensure you achieve reliable power delivery, Cadence Celsius PowerDC technology provides efficient DC analysis for signoff of IC package and PCB designs, including electrical/thermal co-simulation, to maximize accuracy. Celsius PowerDC technology quickly pinpoints excessive IR drop, with areas of excess current density and thermal hotspots, to minimize your designโs risk of field failure.
Highly accurate, even for complex designs with multiple voltage domains and complex plane structures, providing conclusive IR drop analysis for package and board. Automatically set up DC simulations using PowerTree Technology data (source/sink definitions) captured at the schematic stage of the design process. Comprehensive support for multi-structure designs, including stacked die, multiple boards, and all popular package types.