Sigrity X Platform
Step into the future with Sigrity X Platform โ where innovation meets optimization. Unlock the key to flawless signal and power integrity in your PCB and IC package designs, and leap far beyond the current limits of signal integrity (SI)/power integrity (PI) technology. Imagine effortlessly navigating the complexities of electronic design, and not just meeting, but shattering your time-to-market targets with precision and ease.
With Sigrity X, you're not just working with another tool; you're unlocking seamless in-design analysis synergy within the Allegro X PCB and IC Package platforms. Dive into a comprehensive suite of SI/PI analysis, in-design interconnect modeling, and PDN analysis tools designed to supercharge your performance, ensuring your projects not only meet but exceed deadlines and budgets.
Harness the power of the Sigrity X Platform for flawless performance and reliability success in your next design.
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AWR Design Environment Platform
The Cadence AWR Design Environment Platform accelerates RF/microwave product development cycles with design automation that enhances engineering productivity and reduces turnaround time. This seamlessly integrated platform empowers engineers with advanced high-frequency circuit and system simulation coupled with in-design electromagnetic (EM)/thermal analyses for manufacturing-ready high-frequency IP, offering unmatched efficiency and precision. Designed to enhance engineering productivity, the user interface is powerful and intuitive. It offers smart, customizable design flows that cater to the specific needs of today's high-frequency semiconductor and PCB technologies. A unified design capture system facilitates a front-to-back physical design flow. Electrical and layout design entries are dynamically linked, ensuring that components placed in an electrical schematic automatically generate a synchronized physical layout.
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SOLIDWORKS PCB
SOLIDWORKS PCB enables the productivity you need to design Printed Circuit Boards (PCBs) quickly along with unique, collaboration between electrical and 3D mechanical design teams. It offers a clear advantage where ECAD-MCAD collaboration is critical for overall success of electronic product design. Define rigid-flex regions, layers, and stack thicknesses enabling single board rigid-flex PCB design. The rigid-flex layer stack regions can be defined with bend lines and angles and validated with 3D folding and component clearance checking to ensure layout correctness. Manage project, design files and documentation with SOLIDWORKS PCB-PDM Connector and the SOLIDWORKS PDM-based design and data management workflow. Securely store and index design data for fast retrieval, eliminate concerns over version control and data loss, and collaborate on design data from multiple locations. Unmatched ECAD-MCAD integration and collaboration with SOLIDWORKS that unifies design data.
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Ansys HFSS
Multipurpose, full wave 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, components, interconnects, connectors, ICs and PCBs. Ansys HFSS is a 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, antenna arrays, RF or microwave components, high-speed interconnects, filters, connectors, IC packages and printed circuit boards. Engineers worldwide use Ansys HFSS software to design high-frequency, high-speed electronics found in communications systems, advanced driver assistance systems (ADAS), satellites, and internet-of-things (IoT) products. HFSSโs unmatched capacity, coupled with indisputable accuracy, enables engineers to address RF, microwave, IC, PCB and EMI problems for most complex systems. The Ansys HFSS simulation suite consists of a comprehensive set of solvers to address diverse electromagnetic problems.
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