Ansys Icepak
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Perform conduction, convection, and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Ansys’ complete PCB design solution enables you to simulate PCBs, ICs, and packages and accurately evaluate an entire system.
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Diabatix ColdStream
ColdStream is a cloud-native thermal simulation engineering platform that supports your entire thermal management and cooling design process, from thermal analysis to thermal design. Diabatix's thermal simulation software lets your business speed up product development using only state-of-the-art technologies. Get essential heat transfer analyses and insights into temperature distribution, heat dissipation, fluid flow, thermal resistance, thermal radiation, cooling capacity, and more. Do not spend more time looking for the best-suited heat sinks to cool your electronic devices and products, let ColdStream do this for you. You can upload the geometry, configure the thermal simulation operating conditions, and set up the design objectives of your heat sinks in just a few clicks.
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Ansys Sherlock
Ansys Sherlock is the only reliability physics-based electronics design tool that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early stage design. Ansys Sherlock automated design analysis provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages. Sherlock bypasses the ‘test-fail-fix-repeat’ cycle by empowering designers to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs) and assemblies to predict failure risks due to thermal, mechanical and manufacturing stressors--all before prototype. With embedded libraries containing over 500,000 parts, Sherlock rapidly converts electronic computer-aided design (ECAD) files into computational fluid dynamics (CFD) and finite element analysis (FEA) models. Each model contains accurate geometries, material properties and translates stress information.
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SimScale
SimScale is a cloud-based web application that plays a key part in simulation software for many kinds of industries. The platform allows the use of Computational Fluid Dynamics (CFD), Finite Element Analysis (FEA), and Thermal Simulation. It also offers 3D simulation, continuous modeling, and motion & dynamic modeling.
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