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From: Dan M. <da...@us...> - 2004-07-29 01:51:00
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Module Name: pcb Committed By: danmc Date: Thu Jul 29 01:50:52 UTC 2004 Modified Files: pcb/lib: geda.inc Log Message: update the 150 and 300 mil width SOIC packages per the IPC recommendations at footprint.ipc.org. Partially addresses the "silk on pad" bug noted in bug report #995401. To generate a diff of this commit: cvs rdiff -r1.13 -r1.14 pcb/lib/geda.inc To view the diffs online visit: http://cvs.sourceforge.net/viewcvs.py/pcb/pcb/lib/geda.inc?r1=1.13&r2=1.14 Please note that diffs are not public domain; they are subject to the copyright notices on the relevant files. |