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(Apologies for cross-posting.)

 

EURASIP Journal on Advances in Signal Processing

Special issue on Signal Processing in Advanced Nondestructive Materials Inspection

http://www.hindawi.com/journals/asp/si/ndt.html

Announce and Call for papers

 

We would appreciate if you could distribute this information by your colleagues and co-workers.

 

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Dear Colleague,

 

Nowadays, techniques of nondestructive testing (NDT) have evolved greatly due to recent advances in microelectronics and signal processing and analysis. For example, many image processing and analysis techniques can now be readily applied at standard video rates using commercially available hardware, in particular, to methods that generate TV-type image sequences, such as real-time radiography, pulse-video thermography, ultrasonic-phased array, laser ultrasonics, and shearography.

 

The main objective of this special issue on “Signal processing in nondestructive materials inspection” (http://www.hindawi.com/journals/asp/si/ndt.html) of the EURASIP Journal on Advances in Signal Processing (http://www.hindawi.com/journals/asp/) is to promote a comprehensive forum for discussion on the recent advances in signal processing techniques applied to nondestructive material inspection.

 

 

Topics of interest include (not limited to):

 

- Signal processing and analysis in advanced NDT;

- Image processing and analysis in advanced NDT;

- Materials characterization using advanced NDT;

- Defect detection and characterization using advanced NDT;

- Pattern recognition and classification for advanced NDT;

- 3D image reconstruction from advanced NDT data;

- Applications of advanced NDT;

- Algorithms development for signal processing and analysis in advanced NDT;

- Software development for defect detection and characterization in NDT images.

 

 

Submission Instructions:

 

Before submission authors should carefully read over the journal's Author Guidelines, which are located at http://www.hindawi.com/journals/asp/guidelines.html.

Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/ according to the following timetable:

 

Manuscript Due: January 1, 2010;

First Round of Reviews: April 1, 2010;

Publication Date: July 1, 2010.

 

Best regards,

 

Joćo Manuel R. S. Tavares, Department of Mechanical Engineering, Faculty of Engineering, University of Porto, Portugal (tavares@fe.up.pt)

(Lead Guest Editor)

 

Joćo Marcos A. Rebello, Department of Metallurgy and Materials, Technological Center, Faculty of Engineering, Federal University of Rio de Janeiro, Brazil (jmarcos@metalmat.ufrj.br)

(Guest Editor)