RELEASE NOTES (0.47)
4th June 2009
== Introduction ==
We are pleased to release GSS-TCAD 0.47 with GSS-TechSim integrated into GSS-TCAD 0.46-p11. It gives GSS-TCAD
0.46-p11 a big plus in process simulation functions.
== Important Features ==
GSS-TechSim can be used for simulation of thermal diffusion, ion implantation, thermal oxidation, including
supports for high-k materials. By taking the advantages of analytical solution and numerical solution, TechSim
has seen success in simulating bird's beak effect, impurity redistribution effect and some other important
phenomenon is semiconductor industry.
We are pleased to release GSS-TCAD 0.46-p11. This is a maintenance release over 0.46-p10. It contains the following fixes and improvements:
- Fixes a few bugs related to the calculation of Ec and Ev in the presence of band-gap narrowing.
- Fixes a bug related to TIF exports.
- Improved building system to work better with MacOS X, and some Linux/Unix distributions with older GCC compilers.
== Availability ==
The tarball of this release can be found at the download section of our website.
The source code of the project is tracked using Git, a distributed version control system.
The main public repository is at http://github.com/hash/gss-tcad/ , a mirror site is available at http://repo.or.cz/w/gss-tcad.git . The tarball of 0.46-p11 release can be downloaded directly from the repository at http://github.com/hash/gss-tcad/tarball/v0.46.11 . ... read more
Support mixed type simulation (with NGSPICE)
Add energy balance model solver for sub-micron device.
see the webpage for new features.
Please refer to the project's webpage for more information.
please refer to http://daisygdi.sf.net for more details.